JOEO Thermal Shock Test Chamber For Electron Industry
In the electronics industry, the reliability and durability of products are of Paramount importance. In order to ensure the stable operation of electronic equipment in various extreme environments, thermal shock testing has become a key technology.
On March 15, 2024, Guangdong ALI Testing Equipment Co,. Ltd. announced the delivery of thermal shock test chamber to an electronics manufacturer. The chamber will be used for various types of thermal chamber testing and is designed in a 2-zone vertical configuration.
Thermal shock test chamber complies with applicable test standards, including MIL-STD202 Method 107, MIL-STD883 Method 1010, MIL-STD 750-1A, etc. The product under test is cycled between extreme temperatures to expose defects in design or manufacturing. This cycle is made possible by the transfer of product baskets between vertical areas through an automated carriage transport system with a load capacity of 200 pounds,
The thermal shock chamber uses a cascade refrigeration system with a water-cooled condenser. The interior is constructed with welded airtight 304 2B stainless steel lining. The horizontal composite air flow system maximizes indoor air circulation and includes an adjustable air distribution system that allows the end user to fine-tune the air flow according to their product load configuration.
The test chamber features 8 cubic feet of work space and a total height of 80 inches for easy moving in. The studio dimensions are 25.5 "wide x 25.5" deep x 21.75 "high. The maximum temperature in the hot chamber is 200°C and the maximum temperature in the cold chamber is 40°C. The minimum temperature of the hot chamber is higher than the ambient temperature, and the minimum temperature of the cold chamber is -65°C
JOEO thermal shock test chamber features
On March 15, 2024, Guangdong ALI Testing Equipment Co,. Ltd. announced the delivery of thermal shock test chamber to an electronics manufacturer. The chamber will be used for various types of thermal chamber testing and is designed in a 2-zone vertical configuration.
Thermal shock test chamber complies with applicable test standards, including MIL-STD202 Method 107, MIL-STD883 Method 1010, MIL-STD 750-1A, etc. The product under test is cycled between extreme temperatures to expose defects in design or manufacturing. This cycle is made possible by the transfer of product baskets between vertical areas through an automated carriage transport system with a load capacity of 200 pounds,
The thermal shock chamber uses a cascade refrigeration system with a water-cooled condenser. The interior is constructed with welded airtight 304 2B stainless steel lining. The horizontal composite air flow system maximizes indoor air circulation and includes an adjustable air distribution system that allows the end user to fine-tune the air flow according to their product load configuration.
The test chamber features 8 cubic feet of work space and a total height of 80 inches for easy moving in. The studio dimensions are 25.5 "wide x 25.5" deep x 21.75 "high. The maximum temperature in the hot chamber is 200°C and the maximum temperature in the cold chamber is 40°C. The minimum temperature of the hot chamber is higher than the ambient temperature, and the minimum temperature of the cold chamber is -65°C
JOEO thermal shock test chamber features
- Integrated structure, the internal integral TIG seamless welding, beautiful appearance
- Chinese color LCD touch screen man-machine interface + high-performance programmable controller (PLC), with JOEO test box independently developed special software, with automatic, intelligent, human control and other characteristics
- JOEO patent "static balance" technology, low temperature constant temperature season can reach more than 30%. Control mode: constant operation mode, program operation mode
- Refrigeration compressors and key accessories are selected international and domestic well-known brands, long-term reliable operation
- Configure the RJ45 communication interface and remote control system (open data transfer protocol supports Modbus/OPC).
