MIL-STD-810 Method 519 Machine Guns Shaker Testing

MIL-STD-810 method 519 is suitable for applications where materials are required to demonstrate sufficient resistance to a "shooting plan" environment without unacceptable degradation of their structural integrity and functional performance
Cunfirs chaale tante arn narformad ta neida n daaraa af annfidanan that matarial aan ntrunturallar and Ginatianallswithstand the relatively infrequent, short duration transient high rate repetitive shock input encountered in operational environments during the firing of guns.Typically, an application requires some kind of testing method; 519 has four different programs. From an electronic fatigue perspective, these tests can identify damage ranging from glass components to brittle fractures within the system. When the product is used on a fighter jet, a small arms platform, a helicopter, or something completely different, you see all kinds of effects that gunfire and muzzle explosions can have on the product.

The importance of MIL 810 fire impact compliance testing

The MIL-STD-810 machine guns shaker testing is performed to ensure that the material can withstand relatively infrequent, high-frequency repeated inputs. These inputs can be found in the working environment during the shooting.
Gunshot impact Method 519 environment can be considered as high rate repeated impact.
Repeated shocks applied to complex multimodal material systems will cause the material to respond in two ways. First, it will respond with a forced frequency imposed on the material by the external exciting environment. Secondly, it will respond to the resonant natural frequency of the material during or immediately after the application of an external incentive.

Such a response may result in:
Material failure due to increased or decreased friction between parts or general interference between parts.
Changes in the dielectric strength of the material, loss of insulation resistance and/or changes in the strength of the magnetic and static electric fields.
Material electronic line card failure, electronic line card damage, electronic connector failure. Sometimes, circuit card contaminants that can cause a short circuit can fall off as the material reacts to the environment of the gunshot.
Permanent mechanical deformation of a material due to excessive stress on its structure and non-structural members.
The mechanical component of the material collapses due to exceeding the ultimate strength of the component.
Faster material fatigue, also known as low cycle fatigue.
Potential piezoelectric activity of materials.
Material failure due to cracks and breaks in crystal, ceramic, epoxy or glass enclosures.

Mechanical test equipment:

Vibration testing table:
Withstand up to 60 kN (vibration), 120 kN (shock)
Displacement up to 100 mm
Payload up to 2000 kg

Combined vibration/temperature testing
High acceleration impact machine
Acceleration levels up to 30,000 g
Payload up to 100 kg
Special vibrator (asynchronous motion, long stroke reciprocating motion, etc.)
Continuous acceleration (centrifugal) machine
MIL-STD-810, RTCA DO-160
Payload up to 100 kg, acceleration of 20 g
High speed impact machine, up to 500 J

Heavy shaker machine
Payload up to 1,500 kg
Acceleration levels up to 600 g
Half sine wave, sawtooth wave and trapezoidal pulse