Thermal Shock Chambers

Thermal Shock Chambers

High and low temperature (two cases) Thermal Shock Chambers &Three-zone Thermal Shock Chambers.

Thermal Shock Test Chamber (2 Zone)

Thermal Shock Test Chamber (2 Zone)

Mainly used in aviation, aerospace, military units, electronics, IT industry and other test products in the surrounding atmospheric temperature changes under the condition of rapid change in the basic safety test of electronic components, parts and products (whole machine) to provide reliability test, product screening, and so on, at the same time through this test, product quality control.

Meet Standards

GB/T 2423.1 (IEC60068-2-1);GB/T 2423.2 (IEC60068-2-2);GB/T2423.22;GJB 150.3A; GJB 150.4A; GJB 150.5A;GB/T10589; GB/T10592;GB/T11158

Horizontal Thermal Test Chamber

Horizontal Thermal Test Chamber

JOEO horizontal thermal test chamber is the best choice for batch testing and large test loads. The interior design is used for custom environmental stress screening of components and board level electronic components. The carrier basket transfers loads between hot and cold zones in two - or three-zone configurations, and is widely used in automotive, electronic and electrical, aerospace, communication equipment, medical equipment and other industries.

Meet Standards

  • IEC 60068-2-14 Nc - Rapid change of temperature, two-fluid-bath method
  • MIL-STD-883J Method 1011.9 - Military standard, test methods for microcircuits Thermal Shock
  • MIL-STD-202 Method 107 - Military standard, test methods for electronic and electrical component parts Thermal Shock
  • JESD22-A106B - Thermal Shock
  • IEC 60749-11 - Semiconductor devices, Mechanical and climatic test methods Part 11: Rapid change of temperature, Two-fluid-bath method
  • EIAJ ED-4701/307 - Environmental and endurance test methods for semiconductor devices Thermal Shock
Three-Zone Thermal Test Chamber

Three-Zone Thermal Test Chamber

Mainly used in aviation, aerospace, military units, electronics, IT industry and other test products in the surrounding atmospheric temperature changes under the condition of rapid change in the basic safety test of electronic components, parts and products (whole machine) to provide reliability test, product screening, and so on, at the same time through this test, product quality control.

Meet standards

GB/T 2423.1 (IEC60068-2-1);GB/T 2423.2 (IEC60068-2-2);GB/T2423.22;GJB 150.3A; GJB 150.4A; GJB 150.5A;GB/T10589; GB/T10592;GB/T11158

Liquid To Liquid Thermal Shock Chamber

Liquid To Liquid Thermal Shock Chamber

Liquid-to-liquid thermal shock test chambers are often used to test electronic components by abruptly and repeatedly moving them from a container containing a hot liquid to a container containing a cold liquid to withstand strong shocks. The liquid used remains physically unchanged within the temperature range of the climate chamber, subjecting the DUT (device under test) to a strong shock to test its resistance.

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