JOEO horizontal thermal test chamber is the best choice for batch testing and large test loads. The interior design is used for custom environmental stress screening of components and board level electronic components. The carrier basket transfers loads between hot and cold zones in two - or three-zone configurations, and is widely used in automotive, electronic and electrical, aerospace, communication equipment, medical equipment and other industries.
Meet Standards
JOEO Horizontal thermal test chamber are available in a variety of configurations and are the right solution for all thermal shock test requirements for large or batch products.
Two zones, single capacity (-2)
(One hot zone and one cold zone)
The product in the test moves through a carrying basket, alternating between hot and cold zones.
Two-zone Dual Capacity (-2D)
(Two hot zones and one cold zone)
In a two-zone, two-capacity system, the cold zone is always in use, which helps to improve system efficiency.
Three zones, single capacity (-3)
(One hot zone, one normal zone and one cold zone)
In the horizontal three zones, the product moves through the carrier basket between the cold zone and the normal temperature zone, and the hot zone moves to surround the product basket.
Feature
The reference test load of the JOEO thermal test chamber is composed of 12 steel plates. Each pound of steel has an exposed surface area of 65 square inches. The test load is oriented in the product carrier, with the airflow parallel to the steel plate. The load is distributed between two product carriers.
The weight of any additional racks must be included in the test load shown above.
The capacity depends on the stability of the product at extreme temperatures before transfer. Do not use environment dwell time.
When assisted by liquid nitrogen, smaller mechanical refrigeration systems will maintain low temperatures. Liquid nitrogen is required to meet the recovery time.
For a liquid nitrogen only thermal chambers, the maximum load is liquid nitrogen cooling without mechanical cooling.
Use IC chip product loading to recover 9 point products in 15 minutes or less. The load is distributed between two product carriers.
Parameters
Model | Thermal test chamber (2-Zone) | TST-49(A-C) | TST-80(A-C) | TST-150(A-C) | TST-252(A-C) | TST-450(A-C) | TST-900(A-C) |
Internal Dimension WxHxD (mm) | 400x350x350 | 500x400x400 | 600x500x500 | 700x600x600 | 800x750x750 | 1000x900x900 | |
External Dimension WxHxD (mm) | 1400x1800x1400 | 1550x1950x1550 | 1600x1200x1700 | 1700x2100x1750 | 1800x2200x1900 | 2100x2400x2200 | |
Temperature Range of Testing zone |
Type A: -40℃~+150°C (200°C is Optional) |
Type B: -55℃~+150℃ (200°C is Optional) |
Type C: -65℃~+150℃ (200°C is Optional) |
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(High temperature Range of Testing zone : +60°C~+150°C(200°Cis Optional); Low Temperature Range of Testing Zone : -10℃~-40°C/-55°C/-65°C) |
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Exposure Time of High/Low Temperature |
Exposure Time of High Temperature:+60℃~+150℃ (200℃ is Optional) 30Mins | ||||||
Exposure Time of Low Temperature:Type A:-10℃~-40℃/ Type B -55℃/ Type C -65℃ 30Mins | |||||||
Temperature of Heat-storing Slot/ Heating Time |
RT~200°C / About 45mins | ||||||
Temperature of Cool-storing Slot/ Cooling Time |
RT~75°C / About 100mins | ||||||
Temperature RecoveryTime/ Conversion Time |
≤5min/≤5sec | ||||||
Precision Temp-erature Control/ Distribution Accuracy |
±0.5℃/±2℃ | ||||||
Cooling System | Semi-hermetic double-stage compreor(Water-cooled type) Hermetic double-stage compressor (Air-cooled type) |
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Accessories | Viewing window(special opfional) | ||||||
Compressor | French "Tecumseh" Brand, Germany "Bitzer" Brand | ||||||
Power | AC380V: 3phase 5 lines : 50/60HZ | ||||||
Approx. Weight (Kg) | 450 | 600 | 750 | 900 | 1300 | 1500 |