In the comprehensive test, what are the effects of temperature, humidity and vibration on the product
一. Temperature influence and test standards
1. Material thermal stress: metal parts due to temperature difference expansion resulting in structural deformation (such as aluminum alloy every 10℃ temperature difference expansion 0.023mm/m).
Electronic performance drift: The leakage current of semiconductor devices decreases by 90% at -40 ° C and rises by 300% at 125 ° C.
Chemical reaction acceleration: The decomposition rate of lithium-ion battery electrolyte is increased by 5 times above 60 ° C.
2. Test standards
IEC 60068-2-1/-2: Low temperature (-65 ° C) and high temperature (+200 ° C) steady-state test for electronic components.
GB/T 2423.1/-2: China national standard, new rapid temperature change test (≥10℃/min, 2024 revision).
MIL-STD-810H: Temperature shock test for military equipment (-62℃↔+71℃ instantaneous switching).
Second, humidity erosion
Electrochemical corrosion: The corrosion depth of copper alloy at 85%RH/35℃ for 48 hours is > 10μm.
Insulation failure: The dielectric strength of the PCB substrate decreases by 40% after moisture absorption (FR-4 material).
Mold growth: According to ISO 846, the biodegradable material loses 50% of its strength in 95%RH environment for 28 days.
2. Test standards
IEC 60068-2-30: Alternating hygrothermal test (25℃→55℃ cycle, humidity 95%RH).
IPC-TM-650 2.6.3.3: PCB board moisture resistance evaluation (121℃/100%RH).
JEDEC JESD22-A101: Steady-State humidity Life test for semiconductor devices (85 ° C /85%RH, 1000 hours).
3. Vibration mode and test standard
Resonance fatigue: Mechanical structure stress concentration at resonance frequency (such as steel plate amplitude surge 8 times at 20Hz).
Connection failure: The preload force of M6 bolts decreases by 12% per month under 5Grms vibration.
Signal interference: The bit error rate (BER) of 5G millimeter wave antennas increases by 1000 times during 3g vibration.
2. Test standards
IEC 60068-2-64: wide-band random vibration (5-2000Hz, PSD 0.04-0.2 g²/Hz).
ASTM D3580: Packaging and Transportation Vibration Test (ISTA 3E standard spectrum).
SAE J2380: Vibrational durability test for electric vehicle batteries (XYZ triaxial, cumulative 22 hours).
Four, composite environment test standards
1. Temperature vibration coupling test
ISO 16750-4:2005: New test of electric vehicle components (-40 ° C to 85 ° C + 30Grms vibration).
GJB 150.25A: Three comprehensive test for military equipment (temperature cycle + humidity + multi-axis vibration).
2. Collaborative standard of damp and heat vibration
IEC 60068-3-5: Tropical climate simulation (40 ° C /93%RH + sinusoidal vibration).
AEC-Q100 Rev-H: Vehicle gauge chip test (temperature -55℃~150℃ + humidity 85%RH + 50g impact).
1. Material thermal stress: metal parts due to temperature difference expansion resulting in structural deformation (such as aluminum alloy every 10℃ temperature difference expansion 0.023mm/m).
Electronic performance drift: The leakage current of semiconductor devices decreases by 90% at -40 ° C and rises by 300% at 125 ° C.
Chemical reaction acceleration: The decomposition rate of lithium-ion battery electrolyte is increased by 5 times above 60 ° C.
2. Test standards
IEC 60068-2-1/-2: Low temperature (-65 ° C) and high temperature (+200 ° C) steady-state test for electronic components.
GB/T 2423.1/-2: China national standard, new rapid temperature change test (≥10℃/min, 2024 revision).
MIL-STD-810H: Temperature shock test for military equipment (-62℃↔+71℃ instantaneous switching).
Second, humidity erosion
Electrochemical corrosion: The corrosion depth of copper alloy at 85%RH/35℃ for 48 hours is > 10μm.
Insulation failure: The dielectric strength of the PCB substrate decreases by 40% after moisture absorption (FR-4 material).
Mold growth: According to ISO 846, the biodegradable material loses 50% of its strength in 95%RH environment for 28 days.
2. Test standards
IEC 60068-2-30: Alternating hygrothermal test (25℃→55℃ cycle, humidity 95%RH).
IPC-TM-650 2.6.3.3: PCB board moisture resistance evaluation (121℃/100%RH).
JEDEC JESD22-A101: Steady-State humidity Life test for semiconductor devices (85 ° C /85%RH, 1000 hours).
3. Vibration mode and test standard
Resonance fatigue: Mechanical structure stress concentration at resonance frequency (such as steel plate amplitude surge 8 times at 20Hz).
Connection failure: The preload force of M6 bolts decreases by 12% per month under 5Grms vibration.
Signal interference: The bit error rate (BER) of 5G millimeter wave antennas increases by 1000 times during 3g vibration.
2. Test standards
IEC 60068-2-64: wide-band random vibration (5-2000Hz, PSD 0.04-0.2 g²/Hz).
ASTM D3580: Packaging and Transportation Vibration Test (ISTA 3E standard spectrum).
SAE J2380: Vibrational durability test for electric vehicle batteries (XYZ triaxial, cumulative 22 hours).
Four, composite environment test standards
1. Temperature vibration coupling test
ISO 16750-4:2005: New test of electric vehicle components (-40 ° C to 85 ° C + 30Grms vibration).
GJB 150.25A: Three comprehensive test for military equipment (temperature cycle + humidity + multi-axis vibration).
2. Collaborative standard of damp and heat vibration
IEC 60068-3-5: Tropical climate simulation (40 ° C /93%RH + sinusoidal vibration).
AEC-Q100 Rev-H: Vehicle gauge chip test (temperature -55℃~150℃ + humidity 85%RH + 50g impact).
